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MULTICOMP PRO - MP008447 - Heat Sink
FIBOX - TA 201610 ENCLOSURE - Plastic Enclosure
Jacket Material: Unjacketed
MURATA - GRM21BC81E106KE51L - SMD Multilayer Ceramic Capacitor
Drill Bit Size Metric: 1mm
BG405792 Gap Pad Vo Soft, .060" 4"x4" Sheet BERGQUIST MULTICOMP PRO - MP008447 -BERGQUIST BG405792 Gap Pad, Thermally Conductive Interface, Sheet, 0. 8 W m. K, 1. 52 mm Thickness Thermal Conductivity: 0. 8W m. K Conductive Material: Thickness: 1. 52mm Thermal Impedance: Dielectric Strength: External Length: External Width: 100mm Product Range: SVHC: No SVHC (27 Jun 2018) Breakdown Voltage Vbr: 6kV Dielectric Constant: 5. 5 External Depth: 1. 5mm External Length Height: 100mm Insulator Body Material: Gap Pad VO Soft Length: 100mm
